Package Type

Body Size

Lead Count

P-DIP

300 mil

8, 14, 16, 18, 20, 24

600 mil

24, 28, 40

PLCC

Square

20, 28, 44, 68

SOIC

150 mil

8, 14, 16

300 mil

16, 18, 20, 24, 28

PQFP

14 x 20 x 2.7 mm

64, 80, 100

TQFP

10 x 10 x 1.4 mm

44, 64

7 x 7 x 1.0 mm

32

TSSOP

3.0 mm W, 0.65 mm pitch

8, 10

4.4 mm W, 0.65 mm pitch

20, 24, 28

4.4 mm W, 0.50 mm pitch

38

0.153" x 0.390" x0.055"

28

0.153" x 0.192" x 0.055"

16

QFN/MLF/PLLP (lead-less)

3 x 3 mm

6, 12 & 16

4 x 4 mm & 4 x 5 mm

16, 20 & 24

5 x 5 mm

28 & 32

6 x 6 & 7 x 7

40 & 44

SSOP

5.3 mm W, 0.65 mm pitch

28

SIP

0.430 x 0.785 x 0.177"

11

SOT-89

0.095 x 0.177 x 0.060"

3

SOT-223

0.138 x 0.255 x 0.063"

4

TO-220

0.410 x 0.355 x 0.175"

2, 3, 5

TO-263

0.410 x 0.355 x 0.175"

2, 3, 5

TO-3P/TO-247

0.630 x 0.830 x 0.195:

2, 3, 5

TO-3/TO-46/TO-56
TO-8/TO-39/TO-52

Metal Can

2-12

Thermal Enhancement Packages (TEP)

Package Type

Body Size

Lead Count

TEP SOIC

150 mil

8, 16

300 mil

16

150 mil

16, 28

TEP TQFP

10 x 10 x 1.4 mm

44, 64

TEP PQFP

14 x 20 x 2.7 mm

64, 80, 100