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Wafer Mount
Semi-automatic
contactless mounter.
Vacuum mount, no roller.
Bubble-free mounting.
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Wafer Saw
Deionized (DI) Water.
CO2 Bubbler (optional).
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Die Attach
Silver epoxy.
Auto die attach for single
or multi-chip products.
Soft solder with void control.
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Wire Bond
Cratering test to
ensure bond quality.
Low loop control.
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Mold
Real-time X-ray
to check setup.
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Wet Media Deflash
Chemical-free wet media blazing for package and lead-frame surface.
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Deflash, Trim, Form
Automatic pick-and-place on tray to maintain co-planarity.
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Open/Short Test
Verify internal wiring per
customer requirements.
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