Plastic
Packages

P-DIP

14, 16, 18, 20, 24, and 28 lead  (0.300" body) Solder Coat
24, 28, and 40 lead (0.600" body) Solder Coat (See leadframe sizes)

SOIC

8, 14, and 16 lead (0.150" body) (HEAT SINK options available) Solder Plate
16, 20, 24, and 28 lead (0.300" body) Solder Coat (See leadframe sizes)

MSOP (NEW)

8 and 10 lead (3 mm body) Solder Plate

QSOP

16 & 16 lead w/heat sink (0.150" body) Solder Plate (See leadframe sizes)

SSOP (NEW)

30 lead (5.3 mm body) Solder Plate

TSSOP

20 lead Solder Plate (See leadframe sizes)

Die Attach

Epoxy (84-1LMIS standard)

Wire Bond

Thermosonic gold

Molding Compound

Sumitomo 6300H (standard), other mold option available

CERDIP/CERQUAD Packages

Lead Counts

8 through 256 leads

Die Attach

Eutectic or Polyimide

Wire Bond

Ultrasonic Wire Bonding (AlSi)

Seal

Frit

Lead Finish

Solder Coat

Multilayer Ceramic Packages

Package Types

PGA (Pin-Up and Pin-Down)(see available pin count vs cavity size),
LCC, Flat Pack, QFP, DIP, CerPAC, and CerDIP

Lead Count

8 through 447 leads

Die Attach

Eutectic, Polyimide, JM7000, or Epoxy

Wire Bond

Ultrasonic AlSi or Thermosonic gold

Seal

Solder (AuSn), Frit, or Adhesive

Additional
Services

Die Processing

Wafer Sawing: Commercial and
883D Cond. A (Class S) & Cond. B

Additional Package
Types

Ceramic SOIC
Plastic PGA
Chip-On-Board
Chip-On-Tape
MCM Assembly
Flex Circuit Assembly
Hybrid Circuit Assembly