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universal printed circuit co., ltd.

Process Capabilities and Tolerances

Standard Board Thickness & Tolerance:
                 From 0.10mm (0.004") to 2.40mm (0.094")
                             Tolerance: Per IPC Class B.

Minimum Finished Hole Diameter:
   Plated Thru:                       0.15mm (0.006")  
   Blind Via:                             0.10mm (0.004")   1:1 aspect ratio

Materials:   NEMA FR-4/MIL-P-13949 /4 GFN, CEM-3,  Polyimide,
                      High Temp RoHS compliant FR-4, R4003, R4350

Finished Hole Diameter Tolerance:
   Plated Thru:                     +/-0.075mm (0.003")
   Non-Plated Thru:            +/-0.025mm (0.001")
Maximum Panel size:   19" x 20"  Hot Air Solder Leveled (HASL)
                                          18" x 24" All other plating   		Hole Location Tolerance:
                    +/-0.075mm (0.003") < 305mm (12")
                    +/-0.100mm (0.004") > 305mm (12")
Maximum Number of Layers = 12
Outside Dimensional Tolerance:   +/- 0.13mm (0.005") Per IPC Class C
Flatness Tolerance:    Per IPC Class B		 Front-to-Back Registration:
                                 +/-0.075mm (0.003")
Standard Core Dielectric Selection:
                         0.13mm (0.005"), 0.20mm (0.008"),
                         0.46mm (0.018"), 0.056mm (0.022")
                                  0.72mm (0.028")		 Annular Ring Requirements (Metal):
   Pad diameter must exceed the hole diameter by 0.25mm (0.010")
   plus twice the minimum acceptable annular ring.
Minimum Conductor Width/Spacing:
  Gold Plated:                0.10mm(0.004")/0.10mm(0.003")
   All others:                 0.13mm(0.005")/0.13mm(0.005")
   		Annular Ring Requirements (Soldermask):
   Screen Printed:                 0.20mm (0.008") minimum
   Photoimaged:                    0.075mm (0.003") minimum
Standard Plating Thickness:
   Copper:                     13-50 micron (0.0005"-0.002")
   Solder (HASL):        2.5-25 micron (100-1000 µinch)
   Immersion Tin:         0.5-1.0 micron (20-40 µinch)
   Electroplated Ni:      2.5-10 micron (100-400 µinch)
   Flash Gold:               0.025-0.10 micron (1-4 µinch) -- for U/S bonding
   Thick Gold:               0.125-1.0 micron (5-40 µinch) -- for T/S bonding
   Electroless Ni:          2.0-5 micron (80-200 µinch)
   Immersion Gold:       0.025-0.15 micron  (1-6 µinch)
   OSP (Entek):             0.25-0.5 micron  (10-20 µinch)
   Hard Gold:                 0.5-2.0 micron (20-80 µinch) -- for contacts		 Electrical Test
Dual-sided simultaneous:           0.20mm (.008") pitch
(Also see flying probe tester capability for fine pitch)
Maximum panel size:
    1-sided SMT:                   406mm x 520mm (16" x 20.5")
    2-sided SMT:                   260mm x 406mm (10.25" x 16")
    Thru-hole:                        406mm x 520mm (16" x 20.5")
Test Ranges:
    Continuity Resistance:   1-10 Ohm         
    Isolation Resistance:       Up to 100M Ohm
    Voltages:                           10 - 500 VDC
Hi-Pot Test:                          4 KV (AC), 5KV (DC)
Minimum Width of Slots:
   Internal:                     0.6mm (0.024")
   Keyway:                    0.6mm (0.024")		 Impedance control:              28 - 100 ohms, +/-10%
Location Tolerance for Slots, Cutouts, & Notches:
              +/-0.05mm (0.002") < 305mm (12") IPC Class B
              +/-0.20mm (0.008") > 305mm (12") IPC Class B		 V-Scoring:
   Board Thickness:                     0.30-2.40mm (0.012"-0.094")
   Web Thickness Tolerance:    +/-0.05mm (0.002")
    Relative Position Tolerance: +/-0.05mm (0.002")

Current as of January 31, 2005

Contact Us

Phone: 888-225-5459

E-Mail: info@circuitsource.com

Fax:  888-329-2459

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