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Drilling
Accuracy to 0.025 mm (1 mil)
Spindle speed to 110,00 rpm
for holes free of smears
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Laminating
Press
Automatic M/L Press
Microprocessor control
of heat and pressure
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Auto-Plating
Line
Automated for reproducibility
Plating of either copper or gold
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UV Exposure
Semi-automatic UV exposure
LPI opening to 0.1mm (4 mil)
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Hot Air Leveling
Eutectic 63/37 tin/lead coating
for solderability
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Electrical Test
Open/Short testing up to 250 VDC
Flying head tester for small runs or extremely fine pitch
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